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Plating

Reduction of metals and precipitation of a thin layer on the plate surface is named plating. Generally, the plates which have been plated are two kinds, electric and dielectric. The purpose of plating the metals is increasing the corrosion and erosion resistance also decreasing the internal stress. The plating process is done in two fields: industrial and decorative usage. The dielectric plates are plated for different purposes e.g. metallization of printed circuit boards (PCB), decreasing the cost of application in ABS and plastic plating,( plumping and appliances), wax for electroforming and plating of Nano...
 

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07
Electroless Nickel
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Electroless nickel is a process used to deposition a nickel-phosphorus coating onto a suitable substrate such as metal or plastic by chemical reduction without an external electric current.The metallurgical properties of alloys depend on the percentage of phosphorus.

Electroless nickel coating is uniform, hard, relatively brittle, easily solderable, wear and highly corrosion resistant. They can be precipitation hardened to very high levels through the use of low temperature treatments, producing wear resistance equal to that of commercial hard chrome coatings. This combination makes the coating well suited for many severe applications such as oil and ...

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01
Production of Copper Electroless GFC 124
The copper solution has been discussed in this paper is called Copper Electroless GFC 124. This solution is applied for metallization of dielectric surfaces such as fiber, epoxy, etc. This solution is free of cyanide and is produced based on low copper concentration. The deposition of copper ...

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The rate of electroless copper deposition by formaldehyde reduction
In  situ  measurement  of  electroless  plating  rates  of  copper  onto  glass  substrates&nbs...

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