A suitable pretreatment is essential for promoting the adhesion of metallic layer on the substrate. Micro Etch is one of these processes. In this process, the surface of plate will be sensitized which lead to maximum adhesion. Actually in this step, pores are formed and a rough and uniform surface has been made. Then palladium ions will be trapped in these pores and in this way, a suitable situation can prepare for metallic deposition with high adhesion. Micro Etch is used in PCB Plating and Plastic plating industrial. Micro Etch solution makes pores on the surface also removes the rusts and oxides` particle and acts the surface.